OLELO HOOLAHA
Methylhexahydrophthalic anhydride, MHHPA,
Ka helu CAS: 25550-51-0

HUA HUAOLELO
Ka wai kala ʻole
Kala/Hazen ≤20
Maʻiʻo,%: 99.0 Min.
Waiwai Iodine ≤1.0
ʻO Viscosity (25 ℃) 40mPa•s Min
ʻAiki manuahi ≤1.0%
ʻO ke kiko hau ≤-15 ℃
Hui Pū ʻIa: C9H12O3

NA ANO KINO AME KEMIKAL
Kūlana Kino (25 ℃): Wai
Ke ʻano: wai kala ʻole
Kaumaha Molekala: 168.19
Kaumaha Kūikawā (25/4 ℃): 1.162
Hiki i ka wai: decomposes
Hiki ke hoʻoheheʻe ʻia: Hiki ke hoʻoheheʻe ʻia: petroleum ether Hiki ke ʻae: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

NA PALAPALA
Epoxy resin curing agents etc.
ʻO ka MHHPA kahi mea hoʻoponopono epoxy resin curing agent i hoʻohana nui ʻia ma ke kahua uila a me ka electron. Me nā pōmaikaʻi he nui, e laʻa me ka helu heheʻe haʻahaʻa, haʻahaʻa haʻahaʻa o ka hui ʻana me ka salicylic epoxy resins, lōʻihi ka manawa kūpono, kiʻekiʻe ka wela o ka mea i ho'ōla ʻia a me nā waiwai uila maikaʻi loa i ka wela kiʻekiʻe, hoʻohana nui ʻia ʻo MHHPA no ka hoʻopili ʻana i nā wili uila, hoʻolei. nā ʻāpana uila a me nā semiconductor hoʻopaʻa ʻana, e laʻa me nā insulators waho, nā capacitors, nā diodes māmā a me ka hōʻike kikohoʻe.
PIKIHoʻopili ʻia i loko o 25 kg pahu plastik a i ʻole 220kg pahu hao a i ʻole isotank
HOOLAHAE mālama i nā wahi maloʻo maloʻo a pale i ke ahi a me ka maʻamau.