Taw qhia
Methylhexahydrophthalic anhydride, MHHPA,
CAS Nr .: 25550-51-0

PRODUCT SPECIFICATION
Cov tsos mob Colorless kua
Xim / Hazen ≤20
Cov ntsiab lus,%: 99.0 Min.
Tus nqi iodine ≤1.0
viscosity (25 ℃) 40mPa•s Min
Dawb Acid ≤1.0%
Qhov chaw khov kho ≤-15 ℃
Cov qauv formula: C9H12O3

PHYSICAL THIAB CHEMICAL CHARACTERISTICS
Lub cev lub cev (25 ℃): Kua
Cov tsos mob: tsis muaj xim tsis muaj kua
Molecular Luj: 168.19
Specification Gravity (25/4 ℃): 1.162
Dej Solubility: decomposes
Solvent Solubility: Me ntsis Soluble: roj av ether Miscible: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

APPLICATIONS
Epoxy resin curing agents thiab lwm yam.
MHHPA yog ib qho thermo-setting epoxy resin curing tus neeg sawv cev tsuas yog siv hauv hluav taws xob thiab hluav taws xob teb. Nrog rau ntau yam zoo, piv txwv li, tsis tshua muaj melting point, tsis tshua muaj viscosity ntawm cov mixs nrog salicylic epoxy resins, siv sij hawm ntev, siab kub-tiv taus ntawm cov khoom kho thiab zoo heev hluav taws xob khoom ntawm kub kub, MHHPA yog dav siv rau impregnating hluav taws xob coils, casting. cov khoom siv hluav taws xob thiab sealing semiconductors, xws li sab nraum zoov insulators, capacitors, lub teeb emitting diodes thiab cov zaub digital
NtimNtim hauv 25 kg yas nruas los yog 220kg hlau nruas isotank
KHOOMKhaws rau hauv qhov chaw txias, qhuav thiab kom deb ntawm hluav taws thiab noo noo.